Volume 5, Issue 2 (spring 2008 2008)                   IJMSE 2008, 5(2): 1-7 | Back to browse issues page

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N. Hatami,, R. Babaei, P. Davami. MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS. IJMSE. 2008; 5 (2) :1-7
URL: http://ijmse.iust.ac.ir/article-1-131-en.html
Abstract:   (14350 Views)
Abstract: In this study an algorithm for mold-filling simulation with consideration of surface tension has been developed based on a SOLA VOF scheme. As the governing equations, the Navier-Stokes equations for incompressible and laminar flows were used. We proposed a way of considering surface tension in mold-filling simulation. The proposed scheme for surface tension was based on the continuum surface force (CSF) model we could confirm the remarkable effectiveness of the surface tension by experiment which concluded in very positive outcome.
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Type of Study: Research paper |

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